<nobr id="434co"></nobr>
<sub id="434co"></sub><form id="434co"></form>
  • <form id="434co"><legend id="434co"></legend></form>

        <var id="434co"></var>

        Stacked Die Solutions

        Stacked dies with overhang tend to bend and twist during wire bonding process. ASMPT’s wire bonders are equipped with special hardware and software features to bond the ultra-thin over hang dies.

        • Overhang capability
        • Process Features
          • Digital control bond head with closed-loop force feedback
          • Ultra low loop trajectories < 50μm
          • Built-in looping database
          • Programmable focus


        Bond Head

        Enabling Factors for stacked die wire bonding

        • Industry’s best in motion and impact control
        • Intelligent zPS technology
        • Lower mass and inertia
        • Sub pico bonding of sensing

        Low Loop

        • ASMPT unique looping database allows users to load and save a set of qualified looping parameters from/to wire bonder looping library
        • Field proven low loop trajectories
        • Stable and consistent looping performance



        Die Bonding

        Wire Bonding